The annual DesignCon Convention and Exhibition is scheduled to happen January 30 by means of February 1st on the Santa Clara Conference Middle in Santa Clara, Calif. For engineers, that is the right alternative to study in regards to the newest traits and developments in key areas affecting electronics design, whether or not or not it’s sign integrity, board design, semiconductor packaging, automobile electronics, synthetic intelligence, and machine studying, to call just some areas.
Whereas the DesignCon website must be the primary place engineers go to study and register for this necessary present, here’s a random assortment of fascinating periods value attending.
The Position of Chiplets
Unquestionably, many engineers are displaying curiosity in chiplets to assist design the electronics techniques of the longer term. On Tuesday, January 30th, from 4:45 to six:00 pm, there’s a panel session titled, “Chiplets in Client Electronics & Infrastructure: Alternatives & Challenges.” The session will discuss some great benefits of chiplets corresponding to mix-and-match functionality, IP reuse, and quicker time-to-market. A number of mentioned functions embody AR/VR compute silicon, wrist wearable, and show techniques. The session will study 2D, 2.5D, and 3D applied sciences in addition to sign and energy integrity, testing and safety, and EDA instruments.
Check & Measurement For Automobiles
As soon as once more, DesignCon’s Check on Wheels panel will take a look at the distinctive sign integrity challenges encountered within the troublesome automobile atmosphere. Additionally happening Tuesday, January 30th from 4:45 to six pm, the session will take a look at the progress in bringing SERDES compliance take a look at suites (CTS) chipsets, and preliminary take a look at options. This yr’s panel will give attention to classes discovered by the individuals who design the SERDES and interconnect expertise, outline the requirements that promise part interoperability, and create the take a look at devices─what has been leveraged from established HSS requirements like IEEE802.3 (GbE), PCIe, and USB, and what nonetheless wants work.
Software program-Outlined Automobiles
Staying within the automobile realm, the expansion of software-defined autos stays a pronounced development. On Wednesday, January 31st, from 9:00 to 9:45 AM, a session titled “Reliable Software program-Outlined Automobiles” will focus on this expertise’s doubtlessly catastrophic safety dangers. This speak will focus on the important thing necessities, requirements, and methods for constructing reliable software-defined autos by means of a layered data-centric structure that protects the information in movement, guaranteeing that solely licensed knowledge is shared amongst software program parts. The speak will describe how the specified stage of system reliability, resilience, and ASIL stage will be achieved whereas adhering to secure software program growth practices.
Knowledge Facilities and AI
With synthetic intelligence (AI) more and more impacting engineering design, one of many large considerations is the facility wants for supercomputers and knowledge facilities. On Wednesday, January 31st from 4:00 to five:15 pm, a panel session titled, “The Affect of Knowledge Middle & AI Progress on SI/PI (sign integrity/energy integrity) Engineers,” discusses the problem of engineering larger density, larger effectivity energy modules. The session will study the issue of reaching goal impedance ranges beneath 30 microohms, in addition to the resultant thermal challenges. The panelists will take a look at the challenges of analyzing elements corresponding to crosstalk, EMI, and the di/dt of the dynamic present.
PAM-4 Signaling
PAM-4 has been a well-liked subject at latest DesignCon exhibits as extra engineers search to make the most of this modulation approach to double a community’s knowledge vary. To not disappoint, there shall be a number of periods at this yr’s present numerous elements of implementing PAM-4. On Wednesday, January 31st at 9 AM, a session titled, “Enhancing Finish-to-Finish 224G Techniques By Optimizing Conductors for Meta Efficiency,” gives a complete evaluation of the efficiency, design trade-offs, and sensible concerns to boost the Finish-to-Finish 224Gbps Ethernet Channel efficiency, by the mixing of metaconductors on bundle expertise. The mixing of alternating coplanar buildings composed of Copper (Cu) and Cobalt (Co) affords distinct benefits, significantly in lowering the attenuation of single-ended and differential transmission traces. This attribute has vital implications for high-speed end-to-end electrical techniques and their related equalization structure.
EMI and Crypto/Data Gadgets
With the rise in cryptography gadgets that may reveal secret info, there’s the necessity for energy supply networks to take care of {hardware} safety and face up to potential EMI assaults. On Thursday, February 1st at 2 PM, a session titled, “EMI and Intentional EMI Assaults In opposition to Energy Supply Community of Crypto/Data Gadgets,” appears to be like at what occurs when EMI radiation is utilized to the facility supply community of crypto and data gadgets. Additionally, IEMI (intentional EMI) is induced to trigger malfunctioning. The technical paper will reveal the frequencies the place crypto gadgets are weak.
