Whereas Intel has seen its fortunes decline in its core processor markets, the corporate continues to dabble in different applied sciences, one among them optical communications. The U.S. Protection Superior Analysis Initiatives Company (DARPA) has chosen Intel for Section 1 of the House-Primarily based Adaptive Communications Node (House-BACN) program, which goals to create a low-cost, reconfigurable communications terminal that can translate info between numerous satellite tv for pc constellations, on the pace of sunshine.
DARPA envisions a future the place tens of 1000’s of satellites from personal sector organizations ship broadband providers from low earth orbit (LEO). The House-BACN program intends to create an “web” of satellites, enabling seamless communication between navy/authorities and industrial/civil satellite tv for pc constellations.
Intel is among the 10 groups chosen for Section 1 of this program. The opposite groups chosen to work on the reconfigurable optical modem embrace Arizona State College and II-VI Aerospace and Protection.
Intel will develop its optical modem resolution utilizing consultants from its discipline programmable gate array (FPGA) product group, packaging technologists from its Meeting Check Expertise Improvement (ATTD) division and researchers from Intel Labs.
Primarily based on its modern low-power Intel® Agilex™ FPGA, Intel may also design three new chiplets that will likely be built-in utilizing Intel’s embedded multi-die interconnect bridge (EMIB) and superior interface bus (AIB) packaging applied sciences right into a single multi-chip package deal (MCP) that features a DSP/FEC chiplet on Intel 3, probably the most superior digital node, that allows low-power, high-speed digital sign processing.
There may also be an information converter/TIA/driver chiplet, which supplies the best-in-class FinFET RF sign processing for integration of high-speed knowledge converters, TIAs and drivers. There’s additionally a PIC chiplet primarily based on Tower Semiconductor photonic applied sciences provides low-loss waveguides and choices, corresponding to V-groove, enabling automated high-volume fiber coupling integration and meeting.
Intel has commenced Section 1 of this system the place it is going to design every of the above chiplets and work with the opposite program individuals to completely outline the interfaces between the system parts in every of the opposite technical areas. Section 1 will final 14 months and conclude with a preliminary design evaluate.
On the completion of Section 1, chosen performers within the first two technical areas will take part in an 18-month Section 2 to develop engineering design items of the optical terminal parts, whereas performers within the third technical space will proceed to evolve the schema to operate in more difficult and dynamic situations.
Spencer Chin is a Senior Editor for Design Information masking the electronics beat. He has a few years of expertise masking developments in parts, semiconductors, subsystems, energy, and different aspects of electronics from each a enterprise/supply-chain and know-how perspective. He could be reached at [email protected]
